Advanced
IC Packaging, 2007 Edition
A
Strategic Report On Key
Advanced IC Packaging
Technologies and Markets
Price $2495—Published August 2007, 225
pages
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order form
Synopsis
Annual IC shipments will
move past 200 billion units in the very near future. To support the diverse
requirements of this enormous volume, the industry must offer a broad
portfolio of advanced IC packaging technologies.
Electronic Trend Publications (ETP) in its report, Advanced IC Packaging, 2007 Edition, uses
information from IC packaging industry insiders to present the most
realistic picture available regarding advanced IC packaging technologies
and markets.
Chapter 3, The State of the Industry, reviews the status of the
semiconductor industry as of mid-year 2007.
Chapter 4, Wafer-Level Packages (WLPs), presents important WLP
designs that have been introduced over the past year, along with an overall
forecast of the WLP market. Major styles of WLPs—standard
redistribution, stand-off, and back-side filled—are forecast.
Chapter 5, Stacked Packages, explains the basics of this
critical packaging technology, along with a sampling of the latest
products. Forecasts include units, prices, packaging revenue, package
types, device types, first-level interconnection, and applications.
Through-silicon via (TSV) technology is discussed in depth.
In a similar manner, Chapter
6, System in Package (SiP),
presents information on the evolving market for ICs combined with passive
devices within a single package. Forecasts include units, prices, packaging
revenue, device types, interconnection, and applications.
Chapter 7, Interconnection, Flip Chip, and Bumping, contains
a detailed review of first-level package interconnection. Flip chip
forecasts are provided, both within the package and as bare die on the PCB.
Trends in wafer bumping are discussed extensively. Unit forecasts are given
for bump styles, UBM processes, and bump composition. Bumping costs are
discussed.
Chapter 8, Substrates, includes an overview of substrate types,
materials, and highlights of recent developments. Detailed forecasts
covering all major substrate materials are provided for substrate units,
area, and revenue.
Throughout chapters
4–8, the newest packaging products and latest research from numerous
companies and organizations are described.
Trends in advanced IC
packaging are important to your business. Advanced IC Packaging, 2007 Edition will
provide you with an effective and economical tool for assessing the future
of this market. Please take a few moments to review the report's outline on
the following pages. The report sells for $2495, with extra copies $350.
Each copy includes both a hardbound version and a single-user PDF file on
CD-ROM. Corporate licensing is available—contact us for pricing.
Order your copies today!
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the
Industry
World Economic Outlook
Semiconductor Industry
Outlook
Quarterly Update
Chapter 4: Wafer-Level Packages
WLP Technology Overview
WLP Style Forecast
WLP Product Introductions
Other Advanced Packages
Chapter 5: Stacked Packages
Types of Stacked Packages
The Ins and Outs of Stacked
Packages
Interconnection
Wafer Thinning
End Markets/Application
Trends
New Products
Stacked Package Forecast
Stacked Packages by
Application
Stacked Packages by Package
Style
Stacked Packages by Device
Type
Stacked Packages by
Interconnection
Chapter 6: System in Package
(SiP)
Overview
New Product Introductions
SiP Forecast
Summary
SiPs by Application
SiPs by Device Type
SiPs by Interconnection
Chapter 7: Interconnection, Flip
Chip, and Bumping
Interconnection Overview
Wafer Bumping and Processing
New Products
Applications
Interconnection Forecast
Units by Interconnection
Total
Flip Chip Forecast
—In Package and On Board
Flip Chip Bump Styles
UBM Process Techniques
Bump Composition
Chapter 8: Substrates
Ceramic
Laminate
HDIS
Flex Tape
Embedded Passives
Thermal Substrates
New Product Highlights
Forecasts
Units, Area, Revenue by Package
Family
Units, Area, Revenue by Material
Partial List of Figures and Tables
WLP
by I/O Range, 2006–2011
WLP
Assembly Style Distribution, 2007–2011
Interconnection,
2006–2011
Stacked
Packages, 2006–2011
Flash/SRAM
Package Price Comparison
Stacked
Packages by Package Type, 2006–2011
Stacked
Packages by Device Type, 2006–2011
Interconnection
of Stacked Packages, 2006–2011
Application
Breakdown for Stacked Packages, 2007
Cellular
Handsets vs. Stacked Packages, 2006–2011
SiPs,
2006–2011
SiPs
by Device Type, 2006–2011
Interconnection
of SiPs, 2006–2011
Application
Breakdown for SiPs, 2007
Cellular
Handsets vs. SiPs, 2006–2011
Interconnection
Forecast, 2006–2011
Total
Flip Chip Forecast, 2006–2011
Flip
Chip Bump Styles, 2007–2011
UBM
Process, 2007–2011
Bump
Composition Units, 2007–2011
PGA
Unit Forecast by I/O Pitch, 2006–2011
BGA
Unit Forecast by I/O Pitch, 2006–2011
FBGA/DSBGA
Unit Forecast by I/O Pitch, 2006–2011
PGA
Substrates, 2006–2011
BGA
Substrates, 2006–2011
FBGA/DSBGA
Substrates, 2006–2011
Substrate
Area by Package Type, 2006–2011
Average
Substrate Price, 2006–2011
Substrate
Revenue by Package Type, 2006–2011
CSPnl
Cross Sections
Frame
Level RDL
Embedded
Vertical Interconnect Stack
Dual
Die TSOP Stack
Process
Flow of Pre-Process Via Technology
Planar
Bump and Interlocking Bump
SMAFTI
Process Flow
Formation
Process of Vertical Traces
D2W
Ultra-thin Die Stacking
Self-Assembly
Process for 3D Stacked LSI
3D
NAND String Structure
Chip-last
Embedded Actives and Passives
CSMP
on a Silicon Substrate
Chip
Embedding Process
Wafer
Level Package Rewiring
The advanced packaging products, services, and
research of the following companies and organizations are interspersed
throughout the report:
3D
Plus
AI
Technology
Amkor
ASE
Bridge
Semiconductor
CEA-Grenoble—LETI
Ebara
Electrovac
Curamik
Elpida
Memory
Flip
Chip Millennium
Fraunhofer
Institute
Fujikura
General
Electric
Georgia
Tech
Henkel
Hongik
University
Hynix
Semiconductor
IBM
Imbera
IME
Irvine
Sensors
ITRI
JCAP
KAIST
Kyocera
MCSP
Micron
Semiconductor
NEC
Electronics
Nepes
Nokia
Oki
Electric
Panasonic
Factory Solutions
RF
Design Consulting
Samsung
STATS
ChipPAC
STMicroelectronics
Technical
University of Berlin
Teledyne
Tessera
Tohoku
University
Toshiba
Unisem
University
of Arkansas
University
of Southampton
UTAC
Vertical
Circuits
ZyCube
Price $2495—Published August 2007, 225 pages
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