Advanced
IC Packaging Technologies and Markets
2009 Edition
A
Strategic Report On the Latest
Technologies in IC Packaging
With Forecasts of Key Markets
Price $2495—Published September 2009,
225 pages
Download brochure with
order form
Synopsis
Although IC shipments have
dropped significantly in 2009, this is merely a dip in the road. Volumes
have already begun to move upward again, and customers will require an ever-increasing
portfolio of advanced IC packaging technologies.
Electronic Trend Publications (ETP) in its report, Advanced IC Packaging Technologies and
Markets, 2009 Edition, uses information from IC packaging industry insiders
to present the most realistic forecasts available regarding advanced IC
packaging. Throughout the report, the latest advanced packaging products,
services, and research from numerous companies and organizations are
described.
Chapter 3, The State of the
Industry, begins with ETP’s views on the state of the semiconductor
industry. This includes a look at global economic factors that impact the
industry. ETP’s base semiconductor forecast and a mid-year update to
that forecast are also provided.
Chapter 4, Wafer-Level
Packages (WLPs), presents important WLP designs that have been introduced
over the past year. WLP forecasts by pitch, I/O range, and IC product are
given.
Chapter 5, Stacked Packages,
explains the basics of this critical packaging technology, along with a
sampling of the latest products. Forecasts include units, prices, packaging
revenue, package types, device types, first-level interconnection, and
applications. Through-silicon via (TSV) technology is discussed in depth.
In a similar manner, Chapter
6, System in Package (SiP), presents information on the evolving market for
ICs combined with passive devices within a single package. Forecasts
include units, prices, packaging revenue, device types, interconnection,
and applications.
Chapter 7, Interconnection,
Flip Chip, and Bumping, contains a review of first-level package
interconnection. Flip chip forecasts are provided, both within the package
and as bare die on the PCB. Trends in wafer bumping are discussed
extensively. Unit forecasts are given for bump styles, UBM processes, and
bump composition.
Chapter 8, Array QFNs,
reviews the latest
designs in these new
packages. Market forecasts include units, average I/O count, price per I/O,
average assembly price, and
revenue.
Chapter 9, Optical
Interconnect, presents the current state of this exciting packaging
technology of the future. The market potentials of both interchip and
intrachip photonics are explored.
Trends in advanced IC
packaging are important to your business. Advanced IC Packaging Technologies and Markets will provide you
with an effective and economical tool for assessing the future of this
market. The report sells for $2495, with extra copies $350. Each copy
includes both a hardbound version and a single-user PDF file on CD-ROM.
Corporate licensing is available—contact us for pricing. Order your
copies today!
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the
Industry
World Economic Outlook
Semiconductor Industry 2009
Base Forecast
Mid-year Update
Chapter 4: Wafer-Level Packages
WLP Technology Overview
Market Forecasts
New Product Introductions
Other Advanced Packages
Chapter 5: Stacked Packages
Types of Stacked Packages
The Ins and Outs of Stacked
Packages
Interconnection
Wafer Thinning
End Markets/Application
Trends
New Products
Stacked Package Forecasts
Stacked Packages by
Application
End Market
for Stacked Packages
Stacked Packages by Package
Style
Stacked Packages by Device
Type
Stacked Packages by
Interconnection
Chapter 6: System in Package
(SiP)
Overview
New Products
SiP Forecasts
Summary
SiPs by Application
SiPs by Device Type
SiPs by Interconnection
Chapter 7: Interconnection, Flip
Chip, and Bumping
Interconnection Overview
Wafer Bumping and Processing
New Products
Flip Chip Applications
Interconnection Forecast
Units by Interconnection
Total
Flip Chip Forecast
Flip Chip Bump Styles
UBM Process Techniques
Bump Composition
Chapter 8: Array QFNs
Overview
New Products
Market Forecast
Units, Area, Revenue by Package
Family
Units, Area, Revenue by Material
Chapter 9: Optical Interconnect
Technology Basic
Applications/Potential Markets
Industry Highlights
Partial List of Figures and Tables
Nominal
GDP of Major Countries and Regions
Real
GDP Growth for Selected Countries
IC
Units and Revenue, 2008–2013
Summary
IC Unit Forecast by Product, 2008–2013
WLPs
by I/O Range, 2008–2013
WLPs
by IC Product, 2008–2013
WLP
I/O Pitch, 2008–2013
Die
Stack FBGA Packages, 2008–2013
PoP
Packages, 2008–2013
PiP
Packages, 2008–2013
TSOP
Stacked Packages, 2008–2013
QFN
Stacked Packages, 2008–2013
MCM
Stacked Packages, 2008–2013
Stacked
WLPs, 2008–2013
Stacked
Package Assembly Revenue, 2008–2013
Total
ICs in Stacked Packages, 2008–2013
Applications
for Stacked Packages, 2009
Stacked
Packages by Device Type
Interconnection
of Stacked Packages, 2008–2013
SiPs,
2008–2013
SiPs
by Device Type, 2008–2013
Interconnection
of SiPs, 2008–2013
Applications
for SiPs, 2009
QFN
Interconnection Forecast, 2008–2013
PGA
Interconnection Forecast, 2008–2013
BGA
Interconnection Forecast, 2008–2013
FBGA
Interconnection Forecast, 2008–2013
Total
Flip Chip Forecast, 2008–2013
Flip
Chip Bump Styles, 2008–2013
UBM
Process, 2008–2013
Bump
Composition Units, 2008–2013
Devices
in QFN Packages
Array
QFN Forecast, 2009–2013
Amkor’s
FusionQuad
ASAT’s
High-Density Leadframe Array Package Lineup
QFNs-se
HMT
Package Structure
HMT
Summary of Advantages
Board
Level Optical Interconnection
glassPack
SiP
Planar
Optical Integration
Chip-Based
Optical Interconnects
Off-chip
I/O for FPGA on a Waveguide-Integrated SLC
Hybrid
Laser Structure
Terabit
Optical Chip
OBGA
Package Architecture and Design Details
On-Chip
Optical Interconnects
with
Silicon Photonic Circuits
The latest advanced packaging products, services, and
research of the following companies and organizations are interspersed
throughout the report:
AIST
Amkor
ASAT
Auburn
University
Bridgewave
Communications
CEA LETI
MINATEC
Cornell
University
CVInc
Engent
FlipChip
International
Fraunhofer
IZM
Georgia
Tech.
Ghent
University
Hong
Kong University
Ibiden
IBM
IME
IMEC
Intel
Intelligent
Chip Connections
Interconnect
Systems
ITRI
Luxtera
Mitsui
High-tec
NEC
Reflex
Photonics
RTI
Samsung
Sandia
Labs
Sanyo
Shinko Electric
Soitec
STATS
ChipPAC
STMicroelectronics
Sun
Microsystems
Tessera
UCLA
University
of Texas
Price
$2495—Published September 2009, 225 pages
Download brochure with
order form
If you would like to
be added to our mailing list to receive brochures on new reports, click here.
|
