IC
Packaging Materials
2009 Edition
A
Strategic Report On The Diverse Markets
for IC Packaging Materials
Price $1995—Published December 2009,
175 pages
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Synopsis
Although IC
shipments have dropped significantly in 2009, this is merely a dip in the road.
Volumes have already begun to move upward again, and customers will require
an ever-increasing portfolio of IC packaging materials to meet the unique
needs of various products.
In its
report, IC Packaging Materials, 2009
Edition, Electronic Trend Publications
uses information from IC packaging industry insiders to present the most
realistic forecasts available regarding the IC packaging materials markets.
This report covers all the critical materials found in IC packaging, as
well as the newest IC packaging materials and latest research from many
organizations.
Chapter 1
explains the scope and methodology of the report; Chapter 2 summarizes the
IC packaging material revenue.
Chapter 3
presents ETP’s views on the state of the semiconductor industry. This
includes ETP’s base semiconductor forecast and a review of the
industry’s third-quarter results.
Chapter 4
presents the wire bonding market—including wire bonding methods,
product highlights, and forecasts of bonding wire materials, wire
thicknesses, and wire revenue.
Chapter 5
details the leadframe market. This chapter presents product highlights and
leadframe unit and revenue forecasts by I/O count, pitch, and plating
finish.
Chapter 6
presents the substrate market, including an overview of substrate types and
materials, and highlights of recent developments in substrates. Forecasts
are provided for substrate units, area, and revenue by package type and
substrate material.
Chapter 7
gives an overview of the solder sphere market, with product highlights and
forecasts of solder sphere units, price, and revenue by package family,
material, and size.
Chapter 8
reviews the underfill market, with
product highlights and volume and revenue forecasts for the various
types of underfill.
Chapter 9
covers the molding/encapsulation market, including product highlights and
forecasts for the halogen-free transition and overall mold compound
revenue.
As the
future of the IC packaging materials is critical to your business, please
review the report's outline on the following pages. IC Packaging Materials, 2009 Edition will provide you with the
critical information you need to assess this market. The report is
available in electronic format only and is delivered by email as a
single-user PDF file. The report sells for $1995, with extra single-user
licenses at $250 each. Corporate licensing is available—contact us
for pricing.
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the
Industry
World Economic Outlook
2009 Base Forecast
Third-Quarter Update
Chapter 4: Wire Bonding
Wire Bonding Methods
Product Highlights
Forecasts
Units by Package Family
Wire
Usage by Package Family,
Wire Material, and Wire Thickness
Wire Revenue by Material
Chapter 5: Leadframes
Plating Finishes
Product Highlights
Forecasts
Units by I/O
Range, Pitch, and
Plating Finish
Revenue by Size and Plating Finish
Chapter 6: Substrates
Ceramic
Laminate
HDIS
Flex Tape
Embedded Passives
Thermal Substrates
Product Highlights
Forecasts
Units, Area, Revenue by Package
Family
Units, Area, Revenue by Material
Chapter 7: Solder Spheres
Preformed Solder Spheres
Product Highlights
Forecasts
Total Spheres by Package Family,
Size , and Material
Revenue by Material
Chapter 8: Underfill
Underfill Types
Product Highlights
Forecasts
Underfilled Packages by Package
Family
Underfill by Method
Chapter 9: Molding and
Encapsulation
Overview
Product Highlights
Forecasts
Mold Compound by Package Family
Mold Compound Revenue
Partial List of Figures and Tables
IC Packaging
Material Revenue Summary, 2008–2013
Nominal
GDP of Major Countries and Regions
Real GDP
Growth for Selected Countries
IC Units
and Revenue, 2008–2013
Summary
IC Unit Forecast by Product, 2008–2013
Wire
Bonded ICs by Package Family, 2008–2013
Bonding
Wire Usage by Package Family, 2008–2013
Bonding
Wire Usage by Thickness, 2008 vs. 2013
Bonding
Wire Usage by Material, 2008–2013
Bonding
Wire Prices and Revenue, 2008–2013
Leadframe
Packages by I/O Range, 2008–2013
Leadframes
Divided by Size, 2008–2013
Leadframe
Pitch, 2008–2013
Leadframe
Plating Finish, 2008–2013
Cost per
Leadframe, 2008–2013
Total
Leadframe Revenue, 2008–2013
PGA
Units by I/O Pitch, 2008–2013
BGA
Units by I/O Pitch, 2008–2013
FBGA
Units by I/O Pitch, 2008–2013
WLP
Units by I/O Pitch, 2008–2013
PGA
Substrates, 2008–2013
BGA
Substrates, 2008–2013
FBGA
Substrates, 2008–2013
Substrate
Unit Summary, 2008–2013
Average
Substrate Area by Package Type, 2008–2013
Substrate
Area by Package Type, 2008–2013
Substrate
Area Summary, 2008–2013
Average
Substrate Price, 2008–2013
Substrate
Revenue by Package Type, 2008–2013
Substrate
Revenue Summary, 2008–2013
Solder
Spheres by Package Type and
Sphere
Size, 2008–2013
Solder
Spheres by Material, 2008–2013
Solder
Sphere Pricing by Material, 2008–2013
Solder
Sphere Revenue by Material, 2008–2013
Underfilled
Packages by Package Family, 2008–2013
Underfilled
Packages by Underfill Type, 2008–2013
Underfill
Quantity, 2008–2013
Price
per Gram for Underfill, 2008–2013
Underfill
Revenue, 2008–2013
Encapsulated
ICs, 2008–2013
Mold
Compound Usage by Package Family, 2008–2013
Mold
Compound Halogen-Free Transition, 2008–2013
Mold
Compound Price, 2008–2013
Mold
Compound Revenue, 2008–2013
The IC packaging material products, services, and
research of the following companies and organizations are interspersed
throughout the report:
Advanced
Component Labs
AMITEC
Amkor
ASE
Auburn
University
Cicorel
CMK
Dynacraft
Eastern
Company
Endicott
Interconnect
Fraunhofer
Institute
Henkel
Heraeus
Hitachi
Chemical
Imbera
Electronics
Indium
Innovex
Jet
Propulsion Laboratory
Kinsus
Interconnect
Kyocera
LORD
Microbonds
Mitsui
High-tec
MK
Electron
NAMICS
Nan
Ya PCB
NEC
NEC
Toppan
Nippon
Micrometal
NTK
PolySciences
QPL
Rogers
Semiconductor
Packaging Materials
Senju
Metal
Shin-Etsu
MicroSi
Shinko
Electric
Simmtech
Spheretek
Sumitomo
Bakelite
Tanaka
Kikinzoka
Technical
University Berlin
Toppan
Printing
Unimicron
Zymet
Price $1995—Published December 2009,
175 pages
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order form
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