MEMS
Packaging
Markets and Trends
A
Strategic Report on Device-Level Packaging
of MEMS Semiconductor Products
Price $1995—Published January 2008, 150
pages
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order form
Synopsis
Although it is a relatively new technology, the MEMS
(micro-electromechanical systems) market for actuators, accelerometers,
gyroscopes, pressure sensors, and microphones has become a substantial
force in the semiconductor industry. Other MEMS products also show promise.
The manufacturing processes of integrated circuits (ICs)
are the model used for the manufacture of MEMS devices. Not only are MEMS
being created on wafers, but they are being combined in most cases with ICs
within variations of standard IC packages. As such, MEMS package assembly
has become a topic of great interest to the overall semiconductor packaging
industry.
Electronic Trend
Publications (ETP) in its report, MEMS
Packaging Markets and Trends, uses information from semiconductor
industry insiders to present the most realistic picture available regarding
packaging technologies and markets for key MEMS products.
Chapter 1 of the report explains the scope and
methodology of the report, while Chapter 2 summarizes the report’s
key market data.
Chapter 3, Technical Trends, presents a concise
technical overview of the MEMS market.
Topics include applications, device fabrication methods, and
packaging options.
Chapter 4, Product and Company Highlights, presents the
newest packaging products and latest research from over 70 companies and
organizations. This presentation is organized into 17 categories of
products and services.
Chapter 5, Forecasts, presents information on the sensor
and actuator products that define the majority of the robust MEMS market.
Products include accelerometers and gyroscopes, pressure sensors, microphones,
and various actuators.
Forecasts of these MEMS markets include units, package
assembly prices, average I/O counts, average assembly costs, and package
assembly revenue. The MEMS packaging market is poised for substantial
growth in the coming years.
MEMS Packaging
Markets and Trends will provide you with an effective and economical
tool for assessing the future of the MEMS packaging market. Please take a
few moments to review the report's outline on the following pages. The
report is delivered by email as a single-user PDF file. The report sells
for $1995, with extra single-user licenses at $250 each. Corporate
licensing is available—contact us for pricing.
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Technical Trends
Overview
Applications
Device Fabrication
Bulk Micromachining
Surface Micromachining
LIGA
Actuation Methods
Device-Level Testing
Packaging Options
Key Issues
Package Types
Encapsulation
Chapter
4: Product and Company
Highlights
Accelerometers
Actuators
Adaptive Optics
Chemical Sensors
Displays
Gyroscopes
Inertia Sensors
Insulin Pumps
Microphones
Micromirrors
Oscillators/Resonators
Pressure Sensors
RF MEMS
Viscosity Sensors
Foundries and Multi-MEMS Products
Packaging
Contractors and
Prototype/Qualification Services
Substrates
Chapter 5: Forecasts
Microphones
Accelerometers and Gyroscopes
Pressure Sensors
Actuators
Partial List of Figures and Tables
Release of MOEMS
Structure
Early Microresonator
Polysilicon
Integrated Timing Reference
Poly-SiGe MEMS on
Top of CMOS
Poly-SiGe Disk
Resonators
Basic Principle of a
MEMS Microphone
Bulk Micromachined
Silicon Crystal
Surface
Micromachining
CerPak
SEM Image of Metal
Added to the Proof Mass
Multiple Sensing
Gaps
GS3 Sensor Chip
GS3 Function
Microstrip Patch
Antenna
Schematic of 3-D
MEMS Chemical Sensor
Flip Chip Version of
VI-MEMS Concept
Liquid Crystal Cell
Process
Discera Packaged
MEMS Resonator
Schematic
Three-Dimensional View of RF MEMS Package
Schematic of the
Package Process Flow
Schematic Design of
3-D Multilayer Module
Schematic Diagram of
an LCP Surface-Mount Package
Bosch Pressure
Sensor Housing Options
MEMS Microphone
Market, 2007–2012
MEMS Microphone
Packages, 2007–2012
MEMS Microphone
Price per I/O for Package Assembly,
2007–2012
MEMS Microphone
Average Package Price, 2007–2012
MEMS Microphone
Packaging Revenue, 2007–2012
MEMS Accelerometer
and Gyroscope Market, 2007–2012
MEMS Accelerometer
and Gyroscope Packages, 2007–2012
MEMS Accelerometer
and Gyroscope Package
Assembly Price per I/O, 2007–2012
MEMS Accelerometer
and Gyroscope Average I/O Count by Package Type, 2007–2012
MEMS Accelerometer
and Gyroscope Average Package
Assembly Price, 2007–2012
MEMS Accelerometer
and Gyroscope Packaging Revenue, 2007–2012
MEMS Pressure Sensor
Market, 2007–2012
MEMS Pressure Sensor
Packages, 2007–2012
MEMS Pressure Sensor
Average Package Assembly Price
per I/O, 2007–2012
MEMS Pressure Sensor
Average I/O Count by Package Type, 2007–2012
MEMS Pressure Sensor
Average Package Assembly Price, 2007–2012
MEMS Pressure Sensor
Packaging Revenue, 2007–2012
MEMS Actuator
Market, 2007–2012
MEMS Actuator
Packages, 2007–2012
MEMS Actuator
Average Package Assembly Price
per I/O, 2007–2012
MEMS Actuator
Average I/O Count by Package Type, 2007–2012
MEMS Actuator
Average Package Assembly Price, 2007–2012
MEMS Actuator
Packaging Revenue, 2007–2012
The products, services, and research of the following
companies and organizations are presented in Chapter 4 of the report:
Akustica
Amkor Technology
Analog Devices
ASE
Bennington
Microtechnology Center
Bosch Automotive Electronics
Bosch Sensortec
Boston
Micromachines
Carsem
Colibrys
DALSA Semiconductor
Debiotech
Discera
Ecliptek Corporation
Engent
Fraunhofer Institute
Freescale
GE Sensing
Gladiator Technologies
Hamamatsu
Photonics
Hana Group
Honeywell
IBM
IMEC
Infineon
Innovative Micro Technology
InvenSense
Jazz Semiconductor
Knowles Acoustics
Kyocera
Matsushita Electric Works
Mems Technology
MEMSCAP
MEMX
Micralyne
microFAB Bremen
Midwest MicroDevices
Miradia
Momentive Performance Materials
NASA
NeoPhotonics
Norcada
NXP Semiconductors
Oki Electric Industry
Olympus
Omron Electrical Components
Philips Research
Plan Optik AG
QUALCOMM MEMS Technologies
Quantum Leap Packaging
Samsung
Sandia National Laboratories
Seiko Epson Corporation
Semefab (Scotland)
Ltd.
SEMPAC
Sensorcon
Silex Microsystems
SiTime
Sonion MEMS
Spectra-Mat
STMicroelectronics
Teledyne
TeraVicta Technologies
Texas
Instruments
The Bergquist Company
Tokimec
Tronics Microsystems
TSMC
University
of California at Davis
VTI Technologies Oy
WiSpry
X-FAB
Yamaha
Price $1995—Published January 2008, 150
pages
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order form
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